Issued Patents 2021
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11122694 | Printed circuit board and package having the same | Ju Ho Kim | 2021-09-14 |
| 11057993 | Printed circuit board | — | 2021-07-06 |
| 11018115 | Semiconductor package having a high reliability | Ji Hwan Hwang, Sang-Sick Park, Geol Nam | 2021-05-25 |
| 10952316 | Printed circuit board | Ju Ho Kim | 2021-03-16 |
| 10930613 | Semiconductor package having recessed adhesive layer between stacked chips | Sang-Sick Park, Un-Byoung Kang, Teak-Hoon Lee, Ji Hwan Hwang | 2021-02-23 |