Issued Patents 2021
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11069592 | Semiconductor packages including a lower structure, an upper structure on the lower structure, and a connection pattern between the lower structure and the upper structure | Ji Hwang Kim, Jong Bo Shim, Jang-woo Lee, Yung-Cheol Kong | 2021-07-20 |