Issued Patents 2021
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11069592 | Semiconductor packages including a lower structure, an upper structure on the lower structure, and a connection pattern between the lower structure and the upper structure | Ji Hwang Kim, Jong Bo Shim, Yung-Cheol Kong, Young Hoon Hyun | 2021-07-20 |
| 11016637 | Method of and device for managing applications | Jong-hyun Ryu, Yong-gook Park, Jae-Young Lee, Jae-Ho Jung, Yang-Wook Kim | 2021-05-25 |
| 11017877 | Multi-chip package | Dae Hoon Na, Jin Do Byun, Jeong-Don Ihm | 2021-05-25 |
| 10964618 | Semiconductor package and method of manufacturing the same | Kyung Suk Oh, Yung-Cheol Kong, Woo Hyun Park, Jong Bo Shim, Jae-myeong Cha | 2021-03-30 |