JB

Jin Do Byun

Samsung: 1 patents #7,111 of 16,990Top 45%
Overall (2021): #406,982 of 548,734Top 75%
1
Patents 2021

Issued Patents 2021

Showing 1–1 of 1 patents

Patent #TitleCo-InventorsDate
11017877 Multi-chip package Dae Hoon Na, Jang-woo Lee, Jeong-Don Ihm 2021-05-25