Issued Patents 2021
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10964618 | Semiconductor package and method of manufacturing the same | Jang-woo Lee, Kyung Suk Oh, Yung-Cheol Kong, Woo Hyun Park, Jong Bo Shim | 2021-03-30 |
JC
Jae-myeong Cha
Overall (2021): #421,239 of 548,734Top 80%
1
Patents 2021