Issued Patents 2021
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11152416 | Semiconductor package including a redistribution line | Ji Hwang Kim, Chajea Jo, Hyoeun Kim, Sang-Uk Han | 2021-10-19 |
| 10978431 | Semiconductor package with connection substrate and method of manufacturing the same | Ji Hwang Kim, Chajea Jo, Sang-Uk Han | 2021-04-13 |
| 10923428 | Semiconductor package having second pad electrically connected through the interposer chip to the first pad | Ji Hwang Kim, Kilsoo Kim, Jangwoo Lee, Eunhee Jung | 2021-02-16 |