Issued Patents 2021
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10978432 | Semiconductor package | — | 2021-04-13 |
| 10923428 | Semiconductor package having second pad electrically connected through the interposer chip to the first pad | Ji Hwang Kim, Jongbo Shim, Jangwoo Lee, Eunhee Jung | 2021-02-16 |