Issued Patents 2021
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11131568 | Sensor package, method of manufacturing the same, and method of manufacturing lid structure | Sungeun JO, Youngshin Kwon, Minjin Kim, Woonbae Kim, Youngdoo Jung +1 more | 2021-09-28 |
| 11125734 | Gas sensor package | Inho Choi, Minjin Kim, Sungwoo Park, Youngdoo Jung, Sungeun JO | 2021-09-21 |
| 11067554 | Gas sensor package and sensing apparatus including the same | Minjin Kim, Youngdoo Jung, Sungeun JO, Inho Choi | 2021-07-20 |
| 10923428 | Semiconductor package having second pad electrically connected through the interposer chip to the first pad | Ji Hwang Kim, Kilsoo Kim, Jongbo Shim, Jangwoo Lee | 2021-02-16 |