Issued Patents 2021
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11121127 | Integrated circuit chips, integrated circuit packages including the integrated circuit chips, and display apparatuses including the integrated circuit chips | Jun-Gu Kang, Young-Mok Kim, Dae-Cheol Seong, Yune-seok Chung | 2021-09-14 |
| 11107743 | Chip on film package and display device including the same | Seung-Tae Hwang, Jae Choon Kim, Kyung Suk Oh, Jae-Min Jung | 2021-08-31 |
| 10937738 | Semiconductor package and method of manufacturing the same | O-hyun Beak, Keon Kuk, Young-chul Ko | 2021-03-02 |