Issued Patents 2021
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11158603 | Semiconductor package and method of fabricating the same | Hyoeun Kim, Ji Hwang Kim, Seunghoon Yeon, Chajea Jo, Sang-Uk Han | 2021-10-26 |
JY
Jisun YANG
Overall (2021): #403,409 of 548,734Top 75%
1
Patents 2021