Issued Patents 2021
Showing 1–13 of 13 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11195718 | Spacer open process by dual plasma | Tsai Wen Sung, Chun Yan, Hua Chung, Dixit V. Desai, Peter J. Lembesis | 2021-12-07 |
| 11193178 | Thermal processing of closed shape workpieces | Rolf Bremensdorfer, Johannes Keppler | 2021-12-07 |
| 11183397 | Selective etch process using hydrofluoric acid and ozone gases | Qi Zhang, Haichun Yang, Hua Chung, Ting Xie | 2021-11-23 |
| 11164725 | Generation of hydrogen reactive species for processing of workpieces | Qi Zhang, Xinliang Lu, Hua Chung | 2021-11-02 |
| 11164742 | Selective deposition using methylation treatment | Hua Chung, Xinliang Lu | 2021-11-02 |
| 11164727 | Processing of workpieces using hydrogen radicals and ozone gas | Ting Xie, Hua Chung, Bin Dong, Xinliang Lu, Haichun Yang | 2021-11-02 |
| 11094528 | Surface treatment of substrates using passivation layers | Tongchuan Gao, Grigoriy Kishko, Vijay M. Vaniapura | 2021-08-17 |
| 11087409 | Systems and methods for generating accurate transaction data and manipulation | Sam Bobley | 2021-08-10 |
| 11062910 | Surface treatment of silicon or silicon germanium surfaces using organic radicals | Hua Chung, Xinliang Lu | 2021-07-13 |
| 11043393 | Ozone treatment for selective silicon nitride etch over silicon | Shanyu Wang, Ting Xie, Chun Yan, Xinliang Lu, Hua Chung | 2021-06-22 |
| 10964528 | Integration of materials removal and surface treatment in semiconductor device fabrication | Hua Chung, Xinliang Lu, Haochen Li, Ting Xie, Qi Zhang | 2021-03-30 |
| 10950428 | Method for processing a workpiece | Ting Xie, Hua Chung, Xinliang Lu, Shawming Ma | 2021-03-16 |
| 10910228 | Surface treatment of carbon containing films using organic radicals | Hua Chung, Xinliang Lu | 2021-02-02 |