| 11195718 |
Spacer open process by dual plasma |
Tsai Wen Sung, Chun Yan, Hua Chung, Dixit V. Desai, Peter J. Lembesis |
2021-12-07 |
| 11193178 |
Thermal processing of closed shape workpieces |
Rolf Bremensdorfer, Johannes Keppler |
2021-12-07 |
| 11183397 |
Selective etch process using hydrofluoric acid and ozone gases |
Qi Zhang, Haichun Yang, Hua Chung, Ting Xie |
2021-11-23 |
| 11164725 |
Generation of hydrogen reactive species for processing of workpieces |
Qi Zhang, Xinliang Lu, Hua Chung |
2021-11-02 |
| 11164742 |
Selective deposition using methylation treatment |
Hua Chung, Xinliang Lu |
2021-11-02 |
| 11164727 |
Processing of workpieces using hydrogen radicals and ozone gas |
Ting Xie, Hua Chung, Bin Dong, Xinliang Lu, Haichun Yang |
2021-11-02 |
| 11094528 |
Surface treatment of substrates using passivation layers |
Tongchuan Gao, Grigoriy Kishko, Vijay M. Vaniapura |
2021-08-17 |
| 11087409 |
Systems and methods for generating accurate transaction data and manipulation |
Sam Bobley |
2021-08-10 |
| 11062910 |
Surface treatment of silicon or silicon germanium surfaces using organic radicals |
Hua Chung, Xinliang Lu |
2021-07-13 |
| 11043393 |
Ozone treatment for selective silicon nitride etch over silicon |
Shanyu Wang, Ting Xie, Chun Yan, Xinliang Lu, Hua Chung |
2021-06-22 |
| 10964528 |
Integration of materials removal and surface treatment in semiconductor device fabrication |
Hua Chung, Xinliang Lu, Haochen Li, Ting Xie, Qi Zhang |
2021-03-30 |
| 10950428 |
Method for processing a workpiece |
Ting Xie, Hua Chung, Xinliang Lu, Shawming Ma |
2021-03-16 |
| 10910228 |
Surface treatment of carbon containing films using organic radicals |
Hua Chung, Xinliang Lu |
2021-02-02 |