| 11164742 |
Selective deposition using methylation treatment |
Michael X. Yang, Hua Chung |
2021-11-02 |
| 11164727 |
Processing of workpieces using hydrogen radicals and ozone gas |
Ting Xie, Hua Chung, Bin Dong, Haichun Yang, Michael X. Yang |
2021-11-02 |
| 11164725 |
Generation of hydrogen reactive species for processing of workpieces |
Qi Zhang, Hua Chung, Michael X. Yang |
2021-11-02 |
| 11107695 |
Surface smoothing of workpieces |
Qi Zhang, Hua Chung |
2021-08-31 |
| 11062910 |
Surface treatment of silicon or silicon germanium surfaces using organic radicals |
Michael X. Yang, Hua Chung |
2021-07-13 |
| 11043393 |
Ozone treatment for selective silicon nitride etch over silicon |
Shanyu Wang, Ting Xie, Chun Yan, Hua Chung, Michael X. Yang |
2021-06-22 |
| 11039527 |
Air leak detection in plasma processing apparatus with separation grid |
Shuang Meng, Shawming Ma, Hua Chung |
2021-06-15 |
| 10964528 |
Integration of materials removal and surface treatment in semiconductor device fabrication |
Michael X. Yang, Hua Chung, Haochen Li, Ting Xie, Qi Zhang |
2021-03-30 |
| 10950428 |
Method for processing a workpiece |
Ting Xie, Hua Chung, Shawming Ma, Michael X. Yang |
2021-03-16 |
| 10950416 |
Chamber seasoning to improve etch uniformity by reducing chemistry |
Qi Zhang, Hua Chung |
2021-03-16 |
| 10910228 |
Surface treatment of carbon containing films using organic radicals |
Michael X. Yang, Hua Chung |
2021-02-02 |