Issued Patents 2021
Showing 1–12 of 12 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11211459 | Semiconductor device and method of manufacturing a semiconductor device | Andre Brockmeier, Guenter Denifl, Ronny Kern, Michael Knabl, Matteo Piccin | 2021-12-28 |
| 11149351 | Apparatus and method for chemical vapor deposition process for semiconductor substrates | Matthias Kuenle, Johannes Baumgartl, Manfred Engelhardt, Christian Illemann, Olaf Storbeck | 2021-10-19 |
| 11148943 | Glass piece and methods of manufacturing glass pieces and semiconductor devices with glass pieces | Alexander Breymesser, Andre Brockmeier, Carsten von Koblinski | 2021-10-19 |
| 11139375 | Semiconductor device and method of manufacturing a semiconductor device | Carsten Schaeffer, Alexander Breymesser, Bernhard Goller, Ronny Kern, Matteo Piccin +1 more | 2021-10-05 |
| 11107732 | Methods for processing a wide band gap semiconductor wafer, methods for forming a plurality of thin wide band gap semiconductor wafers, and wide band gap semiconductor wafers | Guenter Denifl, Tobias Franz Wolfgang Hoechbauer, Martin Huber, Wolfgang Lehnert, Roland Rupp +1 more | 2021-08-31 |
| 11094779 | Semiconductor device having an edge termination region comprising a first edge termination region of a second conductivity type adjacent to a second edge termination region of a first conductivity type | Philip Christoph Brandt, Andre Rainer Stegner, Frank Pfirsch, Hans-Joachim Schulze, Manfred Pfaffenlehner +1 more | 2021-08-17 |
| 11081393 | Method for splitting semiconductor wafers | Christian Beyer, Hans-Joachim Schulze, Marko Swoboda | 2021-08-03 |
| 11081382 | Method for processing a substrate assembly and wafer composite structure | Peter Irsigler | 2021-08-03 |
| 11046577 | Method for processing a monocrystalline substrate and micromechanical structure | Andre Brockmeier, Roland Rupp | 2021-06-29 |
| 11031483 | Forming semiconductor devices in silicon carbide | Hans-Joachim Schulze, Roland Rupp | 2021-06-08 |
| 10978418 | Method of forming an electrical contact and method of forming a chip package with a metal contact structure and protective layer | Joachim Mahler, Michael Bauer, Jochen Dangelmaier, Reimund Engl, Johann Gatterbauer +6 more | 2021-04-13 |
| 10967450 | Slicing SiC material by wire electrical discharge machining | Nirdesh Ojha, Roland Rupp, Markus Heinrici, Karin Delalut, Claudia Friza | 2021-04-06 |