Issued Patents 2021
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11130200 | Combined laser treatment of a solid body to be split | Ralf Rieske, Jan Richter | 2021-09-28 |
| 11081393 | Method for splitting semiconductor wafers | Christian Beyer, Francisco Javier Santos Rodriguez, Hans-Joachim Schulze | 2021-08-03 |
| 11059202 | Method and device for producing planar modifications in solid bodies | Ralf Rieske, Christian Beyer, Christoph Guenther, Jan Richter | 2021-07-13 |
| 10994442 | Method for forming a crack in the edge region of a donor substrate, using an inclined laser beam | Christian Beyer, Franz Schilling, Jan Richter | 2021-05-04 |
| 10978311 | Method for thinning solid body layers provided with components | Wolfram Drescher, Ralf Rieske, Christian Beyer, Jan Richter | 2021-04-13 |