Issued Patents 2021
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11195713 | Methods of forming a silicon-insulator layer and semiconductor device having the same | Joachim Hirschler, Georg Ehrentraut, Christoffer Erbert, Klaus Goeschl, Michael Hutzler +6 more | 2021-12-07 |
| 10967450 | Slicing SiC material by wire electrical discharge machining | Nirdesh Ojha, Francisco Javier Santos Rodriguez, Roland Rupp, Karin Delalut, Claudia Friza | 2021-04-06 |