Issued Patents 2020
Showing 1–8 of 8 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10867907 | Package substrate and method of fabricating the same | Wei-Chung Lo, Dyi-Chung Hu, Chang-Hong Hsieh | 2020-12-15 |
| 10854803 | Manufacturing method of light emitting device package structure with circuit redistribution structure | Pei-Wei Wang, Cheng-Ta Ko, De-Shiang LIU, Tzyy-Jang Tseng | 2020-12-01 |
| 10756050 | Package structure and bonding method thereof | Tzyy-Jang Tseng, Cheng-Ta Ko, Kai-Ming Yang | 2020-08-25 |
| 10700161 | Substrate structure and manufacturing method thereof | Fu-Yang Chen, Chun-Hsien Chien, Chien-Chou Chen, Wei-Ti Lin | 2020-06-30 |
| 10685922 | Package structure with structure reinforcing element and manufacturing method thereof | Pu-Ju Lin, Cheng-Ta Ko, Tzyy-Jang Tseng, Ra-Min Tain | 2020-06-16 |
| 10658282 | Package substrate structure and bonding method thereof | Cheng-Ta Ko, Kai-Ming Yang, Tzyy-Jang Tseng | 2020-05-19 |
| 10651358 | Light emitting device package structure with circuit redistribution structure and manufacturing method thereof | Pei-Wei Wang, Cheng-Ta Ko, De-Shiang LIU, Tzyy-Jang Tseng | 2020-05-12 |
| 10588214 | Stacked structure and method for manufacturing the same | Tzyy-Jang Tseng, Kai-Ming Yang, Pu-Ju Lin, Cheng-Ta Ko | 2020-03-10 |