Issued Patents 2020
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10867907 | Package substrate and method of fabricating the same | Yu-Hua Chen, Dyi-Chung Hu, Chang-Hong Hsieh | 2020-12-15 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10867907 | Package substrate and method of fabricating the same | Yu-Hua Chen, Dyi-Chung Hu, Chang-Hong Hsieh | 2020-12-15 |