Issued Patents 2020
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10867907 | Package substrate and method of fabricating the same | Yu-Hua Chen, Wei-Chung Lo, Chang-Hong Hsieh | 2020-12-15 |
| 10818584 | Package substrate and package structure | — | 2020-10-27 |
| 10643936 | Package substrate and package structure | — | 2020-05-05 |
| 10535622 | Substrate structure and electronic device having coarse redistribution layer electrically connected to fine redistribution layer | — | 2020-01-14 |