Issued Patents 2020
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10863618 | Composite substrate structure and manufacturing method thereof | Tzyy-Jang Tseng, Bo-Cheng Lin, Chun-Hsien Chien, Chien-Chou Chen | 2020-12-08 |
| 10854803 | Manufacturing method of light emitting device package structure with circuit redistribution structure | Cheng-Ta Ko, Yu-Hua Chen, De-Shiang LIU, Tzyy-Jang Tseng | 2020-12-01 |
| 10651358 | Light emitting device package structure with circuit redistribution structure and manufacturing method thereof | Cheng-Ta Ko, Yu-Hua Chen, De-Shiang LIU, Tzyy-Jang Tseng | 2020-05-12 |
| 10573269 | Data transmission method and electronic device | Wei Zhang, Zhifeng Yang, Wenlin Hou, Yanlin Zhu, Daye Yang | 2020-02-25 |