Issued Patents 2020
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10879167 | Chip packaging structure and manufacturing method thereof | Chun-Hsien Chien, Wen-Liang Yeh, Wei-Ti Lin | 2020-12-29 |
| 10863618 | Composite substrate structure and manufacturing method thereof | Tzyy-Jang Tseng, Pei-Wei Wang, Bo-Cheng Lin, Chun-Hsien Chien | 2020-12-08 |
| 10797017 | Embedded chip package, manufacturing method thereof, and package-on-package structure | Po-Chen Lin, Ra-Min Tain, Chun-Hsien Chien | 2020-10-06 |
| 10700161 | Substrate structure and manufacturing method thereof | Yu-Hua Chen, Fu-Yang Chen, Chun-Hsien Chien, Wei-Ti Lin | 2020-06-30 |
| 10660202 | Carrier structure and manufacturing method thereof | Wen-Liang Yeh, Chun-Hsien Chien, Cheng-Hui Wu | 2020-05-19 |