Issued Patents 2020
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10797017 | Embedded chip package, manufacturing method thereof, and package-on-package structure | Ra-Min Tain, Chun-Hsien Chien, Chien-Chou Chen | 2020-10-06 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10797017 | Embedded chip package, manufacturing method thereof, and package-on-package structure | Ra-Min Tain, Chun-Hsien Chien, Chien-Chou Chen | 2020-10-06 |