Issued Patents 2020
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10881006 | Package carrier and package structure | Pei-Chang Huang, Chi-Chun Po, Chun-Lin Liao, Po-Hsiang Wang, Hsuan-Wei Chen | 2020-12-29 |
| 10797017 | Embedded chip package, manufacturing method thereof, and package-on-package structure | Po-Chen Lin, Chun-Hsien Chien, Chien-Chou Chen | 2020-10-06 |
| 10714448 | Chip module with porous bonding layer and stacked structure with porous bonding layer | Chin-Sheng Wang | 2020-07-14 |
| 10685922 | Package structure with structure reinforcing element and manufacturing method thereof | Pu-Ju Lin, Cheng-Ta Ko, Yu-Hua Chen, Tzyy-Jang Tseng | 2020-06-16 |