Issued Patents 2020
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10863618 | Composite substrate structure and manufacturing method thereof | Pei-Wei Wang, Bo-Cheng Lin, Chun-Hsien Chien, Chien-Chou Chen | 2020-12-08 |
| 10854803 | Manufacturing method of light emitting device package structure with circuit redistribution structure | Pei-Wei Wang, Cheng-Ta Ko, Yu-Hua Chen, De-Shiang LIU | 2020-12-01 |
| 10756050 | Package structure and bonding method thereof | Cheng-Ta Ko, Kai-Ming Yang, Yu-Hua Chen | 2020-08-25 |
| 10685922 | Package structure with structure reinforcing element and manufacturing method thereof | Pu-Ju Lin, Cheng-Ta Ko, Yu-Hua Chen, Ra-Min Tain | 2020-06-16 |
| 10658282 | Package substrate structure and bonding method thereof | Cheng-Ta Ko, Kai-Ming Yang, Yu-Hua Chen | 2020-05-19 |
| 10651358 | Light emitting device package structure with circuit redistribution structure and manufacturing method thereof | Pei-Wei Wang, Cheng-Ta Ko, Yu-Hua Chen, De-Shiang LIU | 2020-05-12 |
| 10588214 | Stacked structure and method for manufacturing the same | Kai-Ming Yang, Pu-Ju Lin, Cheng-Ta Ko, Yu-Hua Chen | 2020-03-10 |