Issued Patents 2020
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10756050 | Package structure and bonding method thereof | Tzyy-Jang Tseng, Cheng-Ta Ko, Yu-Hua Chen | 2020-08-25 |
| 10707640 | Laser-heated cavity system | — | 2020-07-07 |
| 10658282 | Package substrate structure and bonding method thereof | Cheng-Ta Ko, Yu-Hua Chen, Tzyy-Jang Tseng | 2020-05-19 |
| 10588214 | Stacked structure and method for manufacturing the same | Tzyy-Jang Tseng, Pu-Ju Lin, Cheng-Ta Ko, Yu-Hua Chen | 2020-03-10 |