Issued Patents 2020
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10854803 | Manufacturing method of light emitting device package structure with circuit redistribution structure | Pei-Wei Wang, Cheng-Ta Ko, Yu-Hua Chen, Tzyy-Jang Tseng | 2020-12-01 |
| 10651358 | Light emitting device package structure with circuit redistribution structure and manufacturing method thereof | Pei-Wei Wang, Cheng-Ta Ko, Yu-Hua Chen, Tzyy-Jang Tseng | 2020-05-12 |