Issued Patents 2020
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10714448 | Chip module with porous bonding layer and stacked structure with porous bonding layer | Ra-Min Tain | 2020-07-14 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10714448 | Chip module with porous bonding layer and stacked structure with porous bonding layer | Ra-Min Tain | 2020-07-14 |