Issued Patents 2020
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10879167 | Chip packaging structure and manufacturing method thereof | Chien-Chou Chen, Chun-Hsien Chien, Wen-Liang Yeh | 2020-12-29 |
| 10700049 | Light-emitting diode package structure and manufacturing method thereof | Chun-Hsien Chien, Fu-Yang Chen | 2020-06-30 |
| 10700161 | Substrate structure and manufacturing method thereof | Yu-Hua Chen, Fu-Yang Chen, Chun-Hsien Chien, Chien-Chou Chen | 2020-06-30 |