Issued Patents 2020
Showing 26–29 of 29 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10629477 | Raised via for terminal connections on different planes | Chen-Hua Yu, Chi-Hsi Wu, Der-Chyang Yeh, Ming-Shih Yeh, Jing-Cheng Lin +1 more | 2020-04-21 |
| 10622302 | Via for semiconductor device connection and methods of forming the same | Chen-Hua Yu, Chi-Hsi Wu, Wen-Chih Chiou, Tsang-Jiuh Wu, Der-Chyang Yeh +1 more | 2020-04-14 |
| 10541226 | Package structure and method of forming the same | Chen-Hua Yu, Li-Hsien Huang, Chi-Hsi Wu, Der-Chyang Yeh, Hsien-Wei Chen +1 more | 2020-01-21 |
| 10529650 | Semiconductor package and method | Wei-Yu Chen, Der-Chyang Yeh, Li-Hsien Huang, Ming-Shih Yeh | 2020-01-07 |