Issued Patents 2020
Showing 1–9 of 9 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10854590 | Semiconductor die package with more than one hanging die | Sven Albers, Klaus Reingruber, Richard Patten, Georg Seidemann | 2020-12-01 |
| 10816742 | Integrated circuit packages including an optical redistribution layer | Georg Seidemann, Sven Albers, Thomas Wagner, Marc Dittes, Klaus Reingruber +2 more | 2020-10-27 |
| 10793429 | Method for producing packaged MEMS assemblies at the wafer level, and packaged MEMS assembly | Matthias Steiert, Karolina Zogal | 2020-10-06 |
| 10741486 | Electronic components having three-dimensional capacitors in a metallization stack | Klaus Reingruber, Sven Albers | 2020-08-11 |
| 10672731 | Wafer level package structure with internal conductive layer | Sven Albers, Klaus Reingruber, Georg Seidemann, Richard Patten | 2020-06-02 |
| 10651102 | Interposer with conductive routing exposed on sidewalls | Klaus Reingruber, Georg Seidemann, Sonja Koller | 2020-05-12 |
| 10584028 | Method for producing packaged MEMS assemblies at the wafer level, and packaged MEMS assembly | Matthias Steiert, Karolina Zogal | 2020-03-10 |
| 10549985 | Semiconductor package with a through port for sensor applications | Dominic Maier, Matthias Steiert, Chau Fatt Chiang, Bernd Goller, Thomas Kilger +5 more | 2020-02-04 |
| 10553538 | Semiconductor package having a variable redistribution layer thickness | Klaus Reingruber, Sven Albers, Georg Seidemann, Bernd Waidhas, Thomas Wagner +1 more | 2020-02-04 |