Issued Patents 2020
Showing 1–11 of 11 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10854590 | Semiconductor die package with more than one hanging die | Sven Albers, Klaus Reingruber, Richard Patten, Christian Geissler | 2020-12-01 |
| 10816742 | Integrated circuit packages including an optical redistribution layer | Christian Geissler, Sven Albers, Thomas Wagner, Marc Dittes, Klaus Reingruber +2 more | 2020-10-27 |
| 10727197 | Embedded-bridge substrate connectors and methods of assembling same | Bernd Waidhas, Andreas Wolter, Thomas Wagner, Stephan Stoeckl, Laurent Millou | 2020-07-28 |
| 10714455 | Integrated circuit package assemblies including a chip recess | Klaus Reingruber | 2020-07-14 |
| 10700159 | Method of providing partial electrical shielding | Veronica Sciriha | 2020-06-30 |
| 10672731 | Wafer level package structure with internal conductive layer | Sven Albers, Klaus Reingruber, Christian Geissler, Richard Patten | 2020-06-02 |
| 10658201 | Carrier substrate for a semiconductor device and a method for forming a carrier substrate for a semiconductor device | Sonja Koller, Bernd Waidhas | 2020-05-19 |
| 10651102 | Interposer with conductive routing exposed on sidewalls | Klaus Reingruber, Christian Geissler, Sonja Koller | 2020-05-12 |
| 10629731 | Power mesh-on-die trace bumping | Bernd Waidhas, Sonja Koller | 2020-04-21 |
| 10553538 | Semiconductor package having a variable redistribution layer thickness | Klaus Reingruber, Sven Albers, Christian Geissler, Bernd Waidhas, Thomas Wagner +1 more | 2020-02-04 |
| 10546826 | Device containing and method of providing carbon covered copper layer | — | 2020-01-28 |