Issued Patents 2020
Showing 1–9 of 9 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10867934 | Component magnetic shielding for microelectronic devices | Saravana Maruthamuthu, Thomas Ort, Andreas Wolter, Andreas Augustin, Veronica Sciriha | 2020-12-15 |
| 10727197 | Embedded-bridge substrate connectors and methods of assembling same | Georg Seidemann, Andreas Wolter, Thomas Wagner, Stephan Stoeckl, Laurent Millou | 2020-07-28 |
| 10720393 | Molded substrate package in fan-out wafer level package | Lizabeth Keser, Thomas Ort, Thomas Wagner | 2020-07-21 |
| 10699980 | Fan out package with integrated peripheral devices and methods | Lizabeth Keser, Thomas Ort, Thomas Wagner | 2020-06-30 |
| 10665522 | Package including an integrated routing layer and a molded routing layer | Lizabeth Keser, Thomas Ort, Thomas Wagner | 2020-05-26 |
| 10658201 | Carrier substrate for a semiconductor device and a method for forming a carrier substrate for a semiconductor device | Sonja Koller, Georg Seidemann | 2020-05-19 |
| 10629731 | Power mesh-on-die trace bumping | Sonja Koller, Georg Seidemann | 2020-04-21 |
| 10553538 | Semiconductor package having a variable redistribution layer thickness | Klaus Reingruber, Sven Albers, Christian Geissler, Georg Seidemann, Thomas Wagner +1 more | 2020-02-04 |
| 10546817 | Face-up fan-out electronic package with passive components using a support | Lizabeth Keser, Thomas Ort, Thomas Wagner | 2020-01-28 |