| 10867934 |
Component magnetic shielding for microelectronic devices |
Saravana Maruthamuthu, Thomas Ort, Andreas Wolter, Andreas Augustin, Veronica Sciriha |
2020-12-15 |
| 10727197 |
Embedded-bridge substrate connectors and methods of assembling same |
Georg Seidemann, Andreas Wolter, Thomas Wagner, Stephan Stoeckl, Laurent Millou |
2020-07-28 |
| 10720393 |
Molded substrate package in fan-out wafer level package |
Lizabeth Keser, Thomas Ort, Thomas Wagner |
2020-07-21 |
| 10699980 |
Fan out package with integrated peripheral devices and methods |
Lizabeth Keser, Thomas Ort, Thomas Wagner |
2020-06-30 |
| 10665522 |
Package including an integrated routing layer and a molded routing layer |
Lizabeth Keser, Thomas Ort, Thomas Wagner |
2020-05-26 |
| 10658201 |
Carrier substrate for a semiconductor device and a method for forming a carrier substrate for a semiconductor device |
Sonja Koller, Georg Seidemann |
2020-05-19 |
| 10629731 |
Power mesh-on-die trace bumping |
Sonja Koller, Georg Seidemann |
2020-04-21 |
| 10553538 |
Semiconductor package having a variable redistribution layer thickness |
Klaus Reingruber, Sven Albers, Christian Geissler, Georg Seidemann, Thomas Wagner +1 more |
2020-02-04 |
| 10546817 |
Face-up fan-out electronic package with passive components using a support |
Lizabeth Keser, Thomas Ort, Thomas Wagner |
2020-01-28 |