Issued Patents 2020
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10720393 | Molded substrate package in fan-out wafer level package | Thomas Ort, Thomas Wagner, Bernd Waidhas | 2020-07-21 |
| 10699980 | Fan out package with integrated peripheral devices and methods | Bernd Waidhas, Thomas Ort, Thomas Wagner | 2020-06-30 |
| 10665522 | Package including an integrated routing layer and a molded routing layer | Thomas Ort, Thomas Wagner, Bernd Waidhas | 2020-05-26 |
| 10546817 | Face-up fan-out electronic package with passive components using a support | Thomas Ort, Thomas Wagner, Bernd Waidhas | 2020-01-28 |