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Integrated circuit packages including an optical redistribution layer |
Georg Seidemann, Christian Geissler, Sven Albers, Marc Dittes, Klaus Reingruber +2 more |
2020-10-27 |
| 10756042 |
Multi-layer redistribution layer for wafer-level packaging |
— |
2020-08-25 |
| 10727197 |
Embedded-bridge substrate connectors and methods of assembling same |
Bernd Waidhas, Georg Seidemann, Andreas Wolter, Stephan Stoeckl, Laurent Millou |
2020-07-28 |
| 10720393 |
Molded substrate package in fan-out wafer level package |
Lizabeth Keser, Thomas Ort, Bernd Waidhas |
2020-07-21 |
| 10699980 |
Fan out package with integrated peripheral devices and methods |
Lizabeth Keser, Bernd Waidhas, Thomas Ort |
2020-06-30 |
| 10665522 |
Package including an integrated routing layer and a molded routing layer |
Lizabeth Keser, Thomas Ort, Bernd Waidhas |
2020-05-26 |
| 10553538 |
Semiconductor package having a variable redistribution layer thickness |
Klaus Reingruber, Sven Albers, Christian Geissler, Georg Seidemann, Bernd Waidhas +1 more |
2020-02-04 |
| 10546817 |
Face-up fan-out electronic package with passive components using a support |
Lizabeth Keser, Thomas Ort, Bernd Waidhas |
2020-01-28 |