Issued Patents 2020
Showing 1–8 of 8 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10816742 | Integrated circuit packages including an optical redistribution layer | Georg Seidemann, Christian Geissler, Sven Albers, Marc Dittes, Klaus Reingruber +2 more | 2020-10-27 |
| 10756042 | Multi-layer redistribution layer for wafer-level packaging | — | 2020-08-25 |
| 10727197 | Embedded-bridge substrate connectors and methods of assembling same | Bernd Waidhas, Georg Seidemann, Andreas Wolter, Stephan Stoeckl, Laurent Millou | 2020-07-28 |
| 10720393 | Molded substrate package in fan-out wafer level package | Lizabeth Keser, Thomas Ort, Bernd Waidhas | 2020-07-21 |
| 10699980 | Fan out package with integrated peripheral devices and methods | Lizabeth Keser, Bernd Waidhas, Thomas Ort | 2020-06-30 |
| 10665522 | Package including an integrated routing layer and a molded routing layer | Lizabeth Keser, Thomas Ort, Bernd Waidhas | 2020-05-26 |
| 10553538 | Semiconductor package having a variable redistribution layer thickness | Klaus Reingruber, Sven Albers, Christian Geissler, Georg Seidemann, Bernd Waidhas +1 more | 2020-02-04 |
| 10546817 | Face-up fan-out electronic package with passive components using a support | Lizabeth Keser, Thomas Ort, Bernd Waidhas | 2020-01-28 |