Issued Patents 2020
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10854590 | Semiconductor die package with more than one hanging die | Klaus Reingruber, Richard Patten, Georg Seidemann, Christian Geissler | 2020-12-01 |
| 10816742 | Integrated circuit packages including an optical redistribution layer | Georg Seidemann, Christian Geissler, Thomas Wagner, Marc Dittes, Klaus Reingruber +2 more | 2020-10-27 |
| 10741486 | Electronic components having three-dimensional capacitors in a metallization stack | Klaus Reingruber, Christian Geissler | 2020-08-11 |
| 10672731 | Wafer level package structure with internal conductive layer | Klaus Reingruber, Georg Seidemann, Christian Geissler, Richard Patten | 2020-06-02 |
| 10553538 | Semiconductor package having a variable redistribution layer thickness | Klaus Reingruber, Christian Geissler, Georg Seidemann, Bernd Waidhas, Thomas Wagner +1 more | 2020-02-04 |