Issued Patents 2020
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10872881 | Microelectronic packages with high integration microelectronic dice stack | — | 2020-12-22 |
| 10854590 | Semiconductor die package with more than one hanging die | Sven Albers, Klaus Reingruber, Georg Seidemann, Christian Geissler | 2020-12-01 |
| 10816742 | Integrated circuit packages including an optical redistribution layer | Georg Seidemann, Christian Geissler, Sven Albers, Thomas Wagner, Marc Dittes +2 more | 2020-10-27 |
| 10672731 | Wafer level package structure with internal conductive layer | Sven Albers, Klaus Reingruber, Georg Seidemann, Christian Geissler | 2020-06-02 |
| 10622333 | Microelectronic packages with high integration microelectronic dice stack | — | 2020-04-14 |