| 10854590 |
Semiconductor die package with more than one hanging die |
Sven Albers, Richard Patten, Georg Seidemann, Christian Geissler |
2020-12-01 |
| 10816742 |
Integrated circuit packages including an optical redistribution layer |
Georg Seidemann, Christian Geissler, Sven Albers, Thomas Wagner, Marc Dittes +2 more |
2020-10-27 |
| 10741486 |
Electronic components having three-dimensional capacitors in a metallization stack |
Sven Albers, Christian Geissler |
2020-08-11 |
| 10714455 |
Integrated circuit package assemblies including a chip recess |
Georg Seidemann |
2020-07-14 |
| 10680147 |
Method of producing a lighting device |
Peter Nagel |
2020-06-09 |
| 10672731 |
Wafer level package structure with internal conductive layer |
Sven Albers, Georg Seidemann, Christian Geissler, Richard Patten |
2020-06-02 |
| 10651102 |
Interposer with conductive routing exposed on sidewalls |
Christian Geissler, Georg Seidemann, Sonja Koller |
2020-05-12 |
| 10553538 |
Semiconductor package having a variable redistribution layer thickness |
Sven Albers, Christian Geissler, Georg Seidemann, Bernd Waidhas, Thomas Wagner +1 more |
2020-02-04 |