Issued Patents 2020
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10867934 | Component magnetic shielding for microelectronic devices | Saravana Maruthamuthu, Andreas Wolter, Andreas Augustin, Veronica Sciriha, Bernd Waidhas | 2020-12-15 |
| 10720393 | Molded substrate package in fan-out wafer level package | Lizabeth Keser, Thomas Wagner, Bernd Waidhas | 2020-07-21 |
| 10699980 | Fan out package with integrated peripheral devices and methods | Lizabeth Keser, Bernd Waidhas, Thomas Wagner | 2020-06-30 |
| 10665522 | Package including an integrated routing layer and a molded routing layer | Lizabeth Keser, Thomas Wagner, Bernd Waidhas | 2020-05-26 |
| 10546817 | Face-up fan-out electronic package with passive components using a support | Lizabeth Keser, Thomas Wagner, Bernd Waidhas | 2020-01-28 |