Issued Patents 2019
Showing 1–25 of 25 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10515828 | Method of depositing encapsulant along sides and surface edge of semiconductor die in embedded WLCSP | Heinz-Peter Wirtz, Seung Wook Yoon, Pandi C. Marimuthu | 2019-12-24 |
| 10504845 | Method for building up a fan-out RDL structure with fine pitch line-width and line-spacing | — | 2019-12-10 |
| 10475779 | Semiconductor device and method of forming a vertical interconnect structure for 3-D FO-WLCSP | Kang Chen, Seung Wook Yoon | 2019-11-12 |
| 10446459 | Semiconductor device and method of forming encapsulated wafer level chip scale package (EWLCSP) | Thomas Strothmann, Seung Wook Yoon | 2019-10-15 |
| 10446523 | Semiconductor device and method of forming wire studs as vertical interconnect in FO-WLP | Pandi C. Marimuthu, Sheila Marie L. Alvarez, Jose Alvin Caparas, Yang Tan | 2019-10-15 |
| 10446479 | Semiconductor device and method of forming a PoP device with embedded vertical interconnect units | Pandi C. Marimuthu, Kang Chen, Yu Gu, Won Kyoung Choi | 2019-10-15 |
| 10418298 | Semiconductor device and method of forming dual fan-out semiconductor package | — | 2019-09-17 |
| 10388612 | Semiconductor device and method of forming electromagnetic (EM) shielding for LC circuits | Byung Joon Han, Rajendra D. Pendse, Il Kwon Shim, Pandi C. Marimuthu, Won Kyoung Choi +1 more | 2019-08-20 |
| 10304817 | Semiconductor device and method of forming build-up interconnect structures over a temporary substrate | Kang Chen | 2019-05-28 |
| 10297519 | Semiconductor device and method of forming PoP semiconductor device with RDL over top package | — | 2019-05-21 |
| 10297556 | Semiconductor device and method of controlling warpage in reconstituted wafer | Kian Meng Heng, Hin Hwa Goh, Jose Alvin Caparas, Kang Chen, Seng Guan Chow | 2019-05-21 |
| 10297518 | Semiconductor device and method of forming supporting layer over semiconductor die in thin fan-out wafer level chip scale package | Kang Chen, Yu Gu | 2019-05-21 |
| 10242948 | Semiconductor device and method of using substrate having base and conductive posts to form vertical interconnect structure in embedded die package | Il Kwon Shim, Jun Mo Koo, Pandi C. Marimuthu, See Chian Lim | 2019-03-26 |
| 10242887 | Semiconductor device and method of making embedded wafer level chip scale packages | — | 2019-03-26 |
| 10217702 | Semiconductor device and method of forming an embedded SoP fan-out package | Kang Chen | 2019-02-26 |
| 10211183 | Semiconductor device and method of forming shielding layer over integrated passive device using conductive channels | Jianmin Fang, Kang Chen, Haijing Cao | 2019-02-19 |
| 10211171 | Antenna in embedded wafer-level ball-grid array package | Kai Liu | 2019-02-19 |
| 10204866 | Semiconductor device and method of forming sacrificial protective layer to protect semiconductor die edge during singulation | Kang Chen, Jianmin Fang, Xia Feng | 2019-02-12 |
| 10204879 | Semiconductor device and method of forming wafer-level interconnect structures with advanced dielectric characteristics | Kang Chen | 2019-02-12 |
| 10189702 | Semiconductor device and method of forming microelectromechanical systems (MEMS) package | Won Kyoung Choi, Kang Chen, Ivan Micallef | 2019-01-29 |
| 10192801 | Semiconductor device and method of forming vertical interconnect structure in substrate for IPD and baseband circuit separated by high-resistivity molding compound | Jianmin Fang, Kang Chen, Haijing Cao | 2019-01-29 |
| 10192796 | Semiconductor device and method of forming dual-sided interconnect structures in FO-WLCSP | Kang Chen | 2019-01-29 |
| 10181423 | Semiconductor device and method of using a standardized carrier in semiconductor packaging | Thomas Strothmann, Damien M. Pricolo, Il Kwon Shim, Heinz-Peter Wirtz, Seung Wook Yoon +1 more | 2019-01-15 |
| 10177010 | Semiconductor device and method of balancing surfaces of an embedded PCB unit with a dummy copper pattern | Kang Chen, Hin Hwa Goh, Il Kwon Shim | 2019-01-08 |
| 10170385 | Semiconductor device and method of forming stacked vias within interconnect structure for FO-WLCSP | Rui Huang, Kang Chen, Yu Gu | 2019-01-01 |