Issued Patents 2019
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10453774 | Thermally enhanced substrate | Bin Yang, Xia Li | 2019-10-22 |
| 10433425 | Three-dimensional high quality passive structure with conductive pillar technology | Changhan Hobie Yun, Jonghae Kim, Mario Francisco Velez | 2019-10-01 |
| 10339635 | Image processing method and image processing apparatus | Ching-Ju Hsiao, Wen-Tsung Huang | 2019-07-02 |
| 10211171 | Antenna in embedded wafer-level ball-grid array package | Yaojian Lin | 2019-02-19 |