| 10523253 |
Glass substrate including passive-on-glass device and semiconductor die |
Changhan Hobie Yun, Chengjie Zuo, Niranjan Sunil Mudakatte, Shiqun Gu, Jonghae Kim +1 more |
2019-12-31 |
| 10498307 |
Integrated device comprising a capacitor and inductor structure comprising a shared interconnect for a capacitor and an inductor |
Niranjan Sunil Mudakatte, Jonghae Kim, Changhan Hobie Yun, David Francis Berdy, Shiqun Gu +1 more |
2019-12-03 |
| 10490880 |
Glass-based antenna array package |
Jon Bradley Lasiter, Ravindra V. Shenoy, Donald William Kidwell, Jr., Mohammad Ali Tassoudji |
2019-11-26 |
| 10490621 |
Close proximity tunable inductive elements |
Paragkumar Ajaybhai Thadesar, Changhan Hobie Yun, Francesco Carrara, Jonghae Kim, Xiaoju YU +1 more |
2019-11-26 |
| 10490348 |
Two-dimensional structure to form an embedded three-dimensional structure |
Daeik Daniel Kim, Niranjan Sunil Mudakatte, David Francis Berdy, Changhan Hobie Yun, Jonghae Kim +3 more |
2019-11-26 |
| 10433425 |
Three-dimensional high quality passive structure with conductive pillar technology |
Kai Liu, Changhan Hobie Yun, Jonghae Kim |
2019-10-01 |
| 10361149 |
Land grid array (LGA) packaging of passive-on-glass (POG) structure |
Chengjie Zuo, Changhan Hobie Yun, David Francis Berdy, Daeik Daniel Kim, Jonghae Kim |
2019-07-23 |
| 10354795 |
Varying thickness inductor |
Daeik Daniel Kim, Chengjie Zuo, Changhan Hobie Yun, Robert Paul Mikulka, Xiangdong Zhang +2 more |
2019-07-16 |
| 10332671 |
Solenoid inductor |
Niranjan Sunil Mudakatte, Changhan Hobie Yun, Daeik Daniel Kim, David Francis Berdy, Jonghae Kim +2 more |
2019-06-25 |
| 10325855 |
Backside drill embedded die substrate |
Daeik Daniel Kim, Jie Fu, Changhan Hobie Yun, Chin-Kwan Kim, Manuel Aldrete +2 more |
2019-06-18 |
| 10319694 |
Semiconductor assembly and method of making same |
Daniel Daeik Kim, Jie Fu, Manuel Aldrete, Jonghae Kim, Changhan Hobie Yun +2 more |
2019-06-11 |
| 10292269 |
Inductor with metal-insulator-metal (MIM) capacitor |
Niranjan Sunil Mudakatte, Changhan Hobie Yun, Jonghae Kim, Xiaoju YU, Nosun PARK |
2019-05-14 |
| 10290414 |
Substrate comprising an embedded inductor and a thin film magnetic core |
Changhan Hobie Yun, Chengjie Zuo, Daeik Daniel Kim, David Francis Berdy, Je-Hsiung Lan +3 more |
2019-05-14 |
| 10249580 |
Stacked substrate inductor |
Daeik Daniel Kim, Changhan Hobie Yun, David Francis Berdy, Chengjie Zuo, Jonghae Kim |
2019-04-02 |
| 10242957 |
Compartment shielding in flip-chip (FC) module |
Daeik Daniel Kim, Changhan Hobie Yun, David Francis Berdy, Chengjie Zuo, Jonghae Kim +1 more |
2019-03-26 |
| 10187031 |
Tunable matching network |
Yunfei Ma, Chengjie Zuo, David Francis Berdy, Daeik Daniel Kim, Changhan Hobie Yun +4 more |
2019-01-22 |
| 10171112 |
RF multiplexer with integrated directional couplers |
Yunfei Ma, Chengjie Zuo, David Francis Berdy, Daeik Daniel Kim, Changhan Hobie Yun +4 more |
2019-01-01 |