| 10523253 |
Glass substrate including passive-on-glass device and semiconductor die |
Changhan Hobie Yun, Mario Francisco Velez, Niranjan Sunil Mudakatte, Shiqun Gu, Jonghae Kim +1 more |
2019-12-31 |
| 10498307 |
Integrated device comprising a capacitor and inductor structure comprising a shared interconnect for a capacitor and an inductor |
Mario Francisco Velez, Niranjan Sunil Mudakatte, Jonghae Kim, Changhan Hobie Yun, David Francis Berdy +1 more |
2019-12-03 |
| 10490348 |
Two-dimensional structure to form an embedded three-dimensional structure |
Mario Francisco Velez, Daeik Daniel Kim, Niranjan Sunil Mudakatte, David Francis Berdy, Changhan Hobie Yun +3 more |
2019-11-26 |
| 10361149 |
Land grid array (LGA) packaging of passive-on-glass (POG) structure |
Mario Francisco Velez, Changhan Hobie Yun, David Francis Berdy, Daeik Daniel Kim, Jonghae Kim |
2019-07-23 |
| 10354795 |
Varying thickness inductor |
Daeik Daniel Kim, Changhan Hobie Yun, Mario Francisco Velez, Robert Paul Mikulka, Xiangdong Zhang +2 more |
2019-07-16 |
| 10332671 |
Solenoid inductor |
Mario Francisco Velez, Niranjan Sunil Mudakatte, Changhan Hobie Yun, Daeik Daniel Kim, David Francis Berdy +2 more |
2019-06-25 |
| 10325855 |
Backside drill embedded die substrate |
Daeik Daniel Kim, Jie Fu, Changhan Hobie Yun, Chin-Kwan Kim, Manuel Aldrete +2 more |
2019-06-18 |
| 10319694 |
Semiconductor assembly and method of making same |
Daniel Daeik Kim, Jie Fu, Manuel Aldrete, Jonghae Kim, Changhan Hobie Yun +2 more |
2019-06-11 |
| 10312193 |
Package comprising switches and filters |
Shiqun Gu, Steve Fanelli, Husnu Ahmet Masaracioglu |
2019-06-04 |
| 10290414 |
Substrate comprising an embedded inductor and a thin film magnetic core |
Changhan Hobie Yun, Mario Francisco Velez, Daeik Daniel Kim, David Francis Berdy, Je-Hsiung Lan +3 more |
2019-05-14 |
| 10283257 |
Skewed co-spiral inductor structure |
Daeik Daniel Kim, David Francis Berdy, Changhan Hobie Yun, Jonghae Kim |
2019-05-07 |
| 10256863 |
Monolithic integration of antenna switch and diplexer |
Shiqun Gu, Steve Fanelli, Thomas A. Gee, Young Kyu Song |
2019-04-09 |
| 10249580 |
Stacked substrate inductor |
Daeik Daniel Kim, Changhan Hobie Yun, David Francis Berdy, Mario Francisco Velez, Jonghae Kim |
2019-04-02 |
| 10242957 |
Compartment shielding in flip-chip (FC) module |
Daeik Daniel Kim, Changhan Hobie Yun, Mario Francisco Velez, David Francis Berdy, Jonghae Kim +1 more |
2019-03-26 |
| 10187031 |
Tunable matching network |
Yunfei Ma, David Francis Berdy, Daeik Daniel Kim, Changhan Hobie Yun, Je-Hsiung Lan +4 more |
2019-01-22 |
| 10171112 |
RF multiplexer with integrated directional couplers |
Yunfei Ma, David Francis Berdy, Daeik Daniel Kim, Changhan Hobie Yun, Je-Hsiung Lan +4 more |
2019-01-01 |