| 10523253 |
Glass substrate including passive-on-glass device and semiconductor die |
Chengjie Zuo, Mario Francisco Velez, Niranjan Sunil Mudakatte, Shiqun Gu, Jonghae Kim +1 more |
2019-12-31 |
| 10498307 |
Integrated device comprising a capacitor and inductor structure comprising a shared interconnect for a capacitor and an inductor |
Mario Francisco Velez, Niranjan Sunil Mudakatte, Jonghae Kim, David Francis Berdy, Shiqun Gu +1 more |
2019-12-03 |
| 10490621 |
Close proximity tunable inductive elements |
Paragkumar Ajaybhai Thadesar, Mario Francisco Velez, Francesco Carrara, Jonghae Kim, Xiaoju YU +1 more |
2019-11-26 |
| 10490348 |
Two-dimensional structure to form an embedded three-dimensional structure |
Mario Francisco Velez, Daeik Daniel Kim, Niranjan Sunil Mudakatte, David Francis Berdy, Jonghae Kim +3 more |
2019-11-26 |
| 10433425 |
Three-dimensional high quality passive structure with conductive pillar technology |
Kai Liu, Jonghae Kim, Mario Francisco Velez |
2019-10-01 |
| 10361149 |
Land grid array (LGA) packaging of passive-on-glass (POG) structure |
Chengjie Zuo, Mario Francisco Velez, David Francis Berdy, Daeik Daniel Kim, Jonghae Kim |
2019-07-23 |
| 10354795 |
Varying thickness inductor |
Daeik Daniel Kim, Chengjie Zuo, Mario Francisco Velez, Robert Paul Mikulka, Xiangdong Zhang +2 more |
2019-07-16 |
| 10332671 |
Solenoid inductor |
Mario Francisco Velez, Niranjan Sunil Mudakatte, Daeik Daniel Kim, David Francis Berdy, Jonghae Kim +2 more |
2019-06-25 |
| 10332911 |
Integrated circuits (ICs) on a glass substrate |
Shiqun Gu, Daeik Daniel Kim, Matthew Michael Nowak, Jonghae Kim, Je-Hsiung Lan +1 more |
2019-06-25 |
| 10325855 |
Backside drill embedded die substrate |
Daeik Daniel Kim, Jie Fu, Chin-Kwan Kim, Manuel Aldrete, Chengjie Zuo +2 more |
2019-06-18 |
| 10319694 |
Semiconductor assembly and method of making same |
Daniel Daeik Kim, Jie Fu, Manuel Aldrete, Jonghae Kim, David Francis Berdy +2 more |
2019-06-11 |
| 10290414 |
Substrate comprising an embedded inductor and a thin film magnetic core |
Mario Francisco Velez, Chengjie Zuo, Daeik Daniel Kim, David Francis Berdy, Je-Hsiung Lan +3 more |
2019-05-14 |
| 10292269 |
Inductor with metal-insulator-metal (MIM) capacitor |
Niranjan Sunil Mudakatte, Jonghae Kim, Xiaoju YU, Nosun PARK, Mario Francisco Velez |
2019-05-14 |
| 10283257 |
Skewed co-spiral inductor structure |
Daeik Daniel Kim, David Francis Berdy, Chengjie Zuo, Jonghae Kim |
2019-05-07 |
| 10249580 |
Stacked substrate inductor |
Daeik Daniel Kim, David Francis Berdy, Chengjie Zuo, Mario Francisco Velez, Jonghae Kim |
2019-04-02 |
| 10242957 |
Compartment shielding in flip-chip (FC) module |
Daeik Daniel Kim, Mario Francisco Velez, David Francis Berdy, Chengjie Zuo, Jonghae Kim +1 more |
2019-03-26 |
| 10187031 |
Tunable matching network |
Yunfei Ma, Chengjie Zuo, David Francis Berdy, Daeik Daniel Kim, Je-Hsiung Lan +4 more |
2019-01-22 |
| 10171112 |
RF multiplexer with integrated directional couplers |
Yunfei Ma, Chengjie Zuo, David Francis Berdy, Daeik Daniel Kim, Je-Hsiung Lan +4 more |
2019-01-01 |