Issued Patents 2019
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10332911 | Integrated circuits (ICs) on a glass substrate | Shiqun Gu, Daeik Daniel Kim, Jonghae Kim, Changhan Hobie Yun, Je-Hsiung Lan +1 more | 2019-06-25 |
| 10271745 | Monolithic integrated emitter-detector array in a flexible substrate for biometric sensing | Shiqun Gu, Kenneth Kaskoun, Eugene Dantsker, Russel A. Martin | 2019-04-30 |
| 10242957 | Compartment shielding in flip-chip (FC) module | Daeik Daniel Kim, Changhan Hobie Yun, Mario Francisco Velez, David Francis Berdy, Chengjie Zuo +1 more | 2019-03-26 |