| 10511268 |
Segmented thermal and RF ground |
Manuel Aldrete, Bonhoon Koo |
2019-12-17 |
| 10490348 |
Two-dimensional structure to form an embedded three-dimensional structure |
Mario Francisco Velez, Niranjan Sunil Mudakatte, David Francis Berdy, Changhan Hobie Yun, Jonghae Kim +3 more |
2019-11-26 |
| 10468350 |
Semiconductor memory device |
Eunjung Kim, Hui-Jung Kim, Keunnam Kim, Bong-Soo Kim, Yoosang Hwang |
2019-11-05 |
| 10431511 |
Power amplifier with RF structure |
Shu Zhang, Bonhoon Koo, Manuel Aldrete, Jie Fu, Chin-Kwan Kim +2 more |
2019-10-01 |
| 10418333 |
Waveguide along shielded side wall |
Jie Fu, Manuel Aldrete |
2019-09-17 |
| 10373960 |
Semiconductor memory devices including separate upper and lower bit line spacers |
Semyeong Jang, Jemin Park, Yoosang Hwang |
2019-08-06 |
| 10361149 |
Land grid array (LGA) packaging of passive-on-glass (POG) structure |
Chengjie Zuo, Mario Francisco Velez, Changhan Hobie Yun, David Francis Berdy, Jonghae Kim |
2019-07-23 |
| 10354795 |
Varying thickness inductor |
Chengjie Zuo, Changhan Hobie Yun, Mario Francisco Velez, Robert Paul Mikulka, Xiangdong Zhang +2 more |
2019-07-16 |
| 10332671 |
Solenoid inductor |
Mario Francisco Velez, Niranjan Sunil Mudakatte, Changhan Hobie Yun, David Francis Berdy, Jonghae Kim +2 more |
2019-06-25 |
| 10332911 |
Integrated circuits (ICs) on a glass substrate |
Shiqun Gu, Matthew Michael Nowak, Jonghae Kim, Changhan Hobie Yun, Je-Hsiung Lan +1 more |
2019-06-25 |
| 10325859 |
Shielded stacked substrate apparatus and method of fabricating |
Jie Fu, Manuel Aldrete |
2019-06-18 |
| 10325855 |
Backside drill embedded die substrate |
Jie Fu, Changhan Hobie Yun, Chin-Kwan Kim, Manuel Aldrete, Chengjie Zuo +2 more |
2019-06-18 |
| 10290414 |
Substrate comprising an embedded inductor and a thin film magnetic core |
Changhan Hobie Yun, Mario Francisco Velez, Chengjie Zuo, David Francis Berdy, Je-Hsiung Lan +3 more |
2019-05-14 |
| 10283257 |
Skewed co-spiral inductor structure |
David Francis Berdy, Chengjie Zuo, Changhan Hobie Yun, Jonghae Kim |
2019-05-07 |
| 10269808 |
Semiconductor devices and methods of forming semiconductor devices |
Bong-Soo Kim, Jemin Park, Taejin Park, Yoosang Hwang |
2019-04-23 |
| 10262786 |
Stepped-width co-spiral inductor structure |
Babak Nejati, Husnu Ahmet Masaracioglu |
2019-04-16 |
| 10249580 |
Stacked substrate inductor |
Changhan Hobie Yun, David Francis Berdy, Chengjie Zuo, Mario Francisco Velez, Jonghae Kim |
2019-04-02 |
| 10242957 |
Compartment shielding in flip-chip (FC) module |
Changhan Hobie Yun, Mario Francisco Velez, David Francis Berdy, Chengjie Zuo, Jonghae Kim +1 more |
2019-03-26 |
| 10187031 |
Tunable matching network |
Yunfei Ma, Chengjie Zuo, David Francis Berdy, Changhan Hobie Yun, Je-Hsiung Lan +4 more |
2019-01-22 |
| 10171112 |
RF multiplexer with integrated directional couplers |
Yunfei Ma, Chengjie Zuo, David Francis Berdy, Changhan Hobie Yun, Je-Hsiung Lan +4 more |
2019-01-01 |
