Issued Patents 2019
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10511268 | Segmented thermal and RF ground | Daeik Daniel Kim, Bonhoon Koo | 2019-12-17 |
| 10490472 | Air cavity mold | Jie Fu, Hong Bok We | 2019-11-26 |
| 10431511 | Power amplifier with RF structure | Daeik Daniel Kim, Shu Zhang, Bonhoon Koo, Jie Fu, Chin-Kwan Kim +2 more | 2019-10-01 |
| 10418333 | Waveguide along shielded side wall | Daeik Daniel Kim, Jie Fu | 2019-09-17 |
| 10325859 | Shielded stacked substrate apparatus and method of fabricating | Daeik Daniel Kim, Jie Fu | 2019-06-18 |
| 10325855 | Backside drill embedded die substrate | Daeik Daniel Kim, Jie Fu, Changhan Hobie Yun, Chin-Kwan Kim, Chengjie Zuo +2 more | 2019-06-18 |
| 10319694 | Semiconductor assembly and method of making same | Daniel Daeik Kim, Jie Fu, Jonghae Kim, Changhan Hobie Yun, David Francis Berdy +2 more | 2019-06-11 |