Issued Patents 2019
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10516092 | Interface substrate and method of making the same | Jon Aday, Steve Joseph Bezuk, Nicholas Ian Buchan | 2019-12-24 |
| 10490472 | Air cavity mold | Jie Fu, Manuel Aldrete | 2019-11-26 |
| 10410971 | Thermal and electromagnetic interference shielding for die embedded in package substrate | David Fraser Rae, Christopher J. Healy, Chin-Kwan Kim | 2019-09-10 |
| 10403707 | Array type inductor | Chin-Kwan Kim, Joonsuk Park | 2019-09-03 |
| 10181410 | Integrated circuit package comprising surface capacitor and ground plane | Young Kyu Song, Kyu-Pyung Hwang | 2019-01-15 |