Issued Patents 2019
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10410971 | Thermal and electromagnetic interference shielding for die embedded in package substrate | Hong Bok We, Christopher J. Healy, Chin-Kwan Kim | 2019-09-10 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10410971 | Thermal and electromagnetic interference shielding for die embedded in package substrate | Hong Bok We, Christopher J. Healy, Chin-Kwan Kim | 2019-09-10 |