Issued Patents 2019
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10242948 | Semiconductor device and method of using substrate having base and conductive posts to form vertical interconnect structure in embedded die package | Il Kwon Shim, Jun Mo Koo, Pandi C. Marimuthu, Yaojian Lin | 2019-03-26 |