Issued Patents 2019
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10242948 | Semiconductor device and method of using substrate having base and conductive posts to form vertical interconnect structure in embedded die package | Il Kwon Shim, Pandi C. Marimuthu, Yaojian Lin, See Chian Lim | 2019-03-26 |