Issued Patents 2019
Showing 1–8 of 8 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10515828 | Method of depositing encapsulant along sides and surface edge of semiconductor die in embedded WLCSP | Yaojian Lin, Heinz-Peter Wirtz, Seung Wook Yoon | 2019-12-24 |
| 10510632 | Method of packaging thin die and semiconductor device including thin die | Won Kyoung Choi | 2019-12-17 |
| 10453785 | Semiconductor device and method of forming double-sided fan-out wafer level package | Il Kwon Shim, Won Kyoung Choi, Sze Ping Goh, Jose Alvin Caparas | 2019-10-22 |
| 10446523 | Semiconductor device and method of forming wire studs as vertical interconnect in FO-WLP | Sheila Marie L. Alvarez, Yaojian Lin, Jose Alvin Caparas, Yang Tan | 2019-10-15 |
| 10446479 | Semiconductor device and method of forming a PoP device with embedded vertical interconnect units | Yaojian Lin, Kang Chen, Yu Gu, Won Kyoung Choi | 2019-10-15 |
| 10388612 | Semiconductor device and method of forming electromagnetic (EM) shielding for LC circuits | Yaojian Lin, Byung Joon Han, Rajendra D. Pendse, Il Kwon Shim, Won Kyoung Choi +1 more | 2019-08-20 |
| 10242948 | Semiconductor device and method of using substrate having base and conductive posts to form vertical interconnect structure in embedded die package | Il Kwon Shim, Jun Mo Koo, Yaojian Lin, See Chian Lim | 2019-03-26 |
| 10181423 | Semiconductor device and method of using a standardized carrier in semiconductor packaging | Thomas Strothmann, Damien M. Pricolo, Il Kwon Shim, Yaojian Lin, Heinz-Peter Wirtz +1 more | 2019-01-15 |